How Laser Soldering Works And Why You Should Be Interested

Laser soldering is a non-contact process that eliminates the risk of marring or damaging sensitive components.  Robots are capable of producing micro-sized laser beams for otherwise difficult applications too small for iron tip soldering.  Our advanced optical technology provides a reliable solution for micro and narrow pitched parts used in high-density electronic equipment.  

The laser soldering process depends on the type of solder to be used (wire, pre-form or paste). In the case of solder wire, laser irradiation is performed in advance to the joint area (pre-heating). This is the most important process in order to wet and allow the solder to flow easily when supplying the solder wire to the joint area.   


Our Desktop Laser-Soldering Robot

This robot is non-contact soldering that heats up the target with a high energy light emitted from an oscillated laser diode and is focused with a lens. Wavelength can be either 808nm or 980nm, varying between models.

Type MLU-808FS MLU-980FS
Material Semiconductor Laser
Oscillation CW (Continuous Wave)
LD Type Fiber Coupling
LD Output 50W
Wavelength 808 nm 980 nm
Guide Beam Included
Halation Prevention Included
LD Cooling System Electric Cooling
Coaxial Observation Function Included
Fiber Core Diameter φ200μm φ400μm
Fiber Length 3m
Focused Beam Diameter φ50μm~8000μm
Focal Length 10mm ~ 200 mm (actual focal length may vary based upon beam diameter.)
Focused Beam Shape Circular, rectangular, or free shape option via SLIT laser
Temperature Control Available
Parameter Control Mode Time Setting Resolution 0.1 sec 0.01 sec
Time Setting 1 STEP = 0.1 sec. (Max: 0.1sec. ×100STEP = 10sec.)
Current (A) Control Setting Resolution 0.1A
Registered Waveform Capacity 16
Interface Input Terminal x 1; Sig. OUT (BNC) x 1; CURR. MINI (BNC) x 1; RS232 x 1; Analog Input (0~5V) x 1
Dimensions WxDxH Laser Head 160.5 x 114 x 366 mm (Max size)
Laser Oscillation Unit 270 x 260 x 230 mm
Laser Controller 430 x 350 x 149 mm
Weight Laser Head Approx 1 kg
Laser Oscillation Unit Approx 6.5 kg
Laser Controller Approx 16 kg
Power Single Phase AC100V AC220V ± 10% 50/60 Hz

Slit Beam: Laser-Shaping Technology Option

Although the laser beam shape is generally circular, this originally developed SLIT plate (metal plate with a hole) enables virtually any type of laser beam shape. Since the beam shape can be conformed to the part shape, damage to adjacent parts is greatly reduced.

Solder Paste Dispensers

Achieve ultimate small volume stability with precision nozzels. Dispensing technology provides an alternative to the classic wire feed approach. Dispensers allow for a precise amount of solder paste to be evenly distributed in micro amounts. This approach eliminates waste and increases cost effectiveness.


The type of lens to form a laser beam is composed of two components, the “Input lens” and “Output lens”. With the combination of these lenses, over 100 diameter variations can be achieved.

The TCU-1000 Optional Unit

This non-contact radiation thermometer measures the temperature of the soldering point in real time. Select it from the accessories listing below to learn more about how it can keep your laser machine stable.